Sticking Apparatus and Sticking Method

ABSTRACT

A sticking apparatus  10  includes a sticking table  11  supporting a semiconductor wafer W and a Sticking unit  12  sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit  12  includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit  40  provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit  40  includes a moving member  50  that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit  41,  enabling to stick the adhesive sheet S on the wafer W.

TECHNICAL FIELD

The present invention relates to a sticking apparatus and a stickingmethod, in particular, to a sticking apparatus and a sticking method inwhich the occurrence of wrinkles and the mixing of air bubbles can beprevented when an adhesive sheet is stuck on a plate-like member such asa semiconductor wafer or the like.

BACKGROUND ART

Conventionally, after separating a semiconductor wafer (hereinafter,simply referred to as “wafer”) on which a circuit surface is formed intoindividual chips, each chip is picked up and bonded on a lead frame (diebonding). The die bonding can be carried out in such a way that a heatsensitive adhesive sheet for die bonding is stuck in advance, in awafer-processing step.

A sticking apparatus of the adhesive sheet has been disclosed, forinstance, in the patent document 1. The sticking apparatus disclosed inthe patent document 1 is arranged to include a table that sucks andsupports a wafer in a state that a rear surface side of the wafer ispositioned so as to be an upper face side thereof, a sheet supplyingunit that supplies an adhesive sheet for die bonding to the upper faceside of the wafer, and a press roll that presses the adhesive sheetsupplied to the upper face side of the wafer to stick the adhesive sheetto the wafer. Herein a cover sheet (a release liner) is temporarilybonded to one side face of the adhesive sheet, and after the adhesivesheet is stuck on the wafer, the release liner is peeled off.

[Patent document 1] Japanese Patent Application Laid-open No.2003-257898

DISCLOSURE OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

Conventionally, since a raw sheet of the adhesive sheet hasmulti-layered structure with the release liner, the release liner ispeeled off at a peeling section and wound up in a prior stage of theadhesive sheet sticking on the rear surface of the wafer. There happenssometimes, however, such a problem that the quality standard of some rawsheets do not conform with required product accuracy. For instance, insome cases, temporary adhesive strength between the adhesive sheet andthe release liner is not uniform in an extending direction of the rawsheet. Accordingly, in the case where such a raw sheet is mixed as theadhesive sheet and the release liner in a specific area along theextending direction are temporarily bonded to each other more stronglythan in other areas, there is a tendency that a peeling-off is notcarried out at an original peeling-off position in the peeling sectionbut delayed peeling-off is brought about and the adhesive sheet istrailed by the release liner, resulting in that the adhesive sheet ispulled towards a winding side of the release liner. In this case, anunintended tension force is generated in the adhesive sheet between thepeeling section and the press roll for pressing the adhesive sheet tothe wafer, which causes the occurrence of warp deformation or wrinkleson the wafer after sticking operation.

Moreover, in the case where the adhesive sheet is stuck on the wafertogether with the release liner, peeling-off of the release liner in thearea having strong temporary adhesive strength may cause inclusion ofthe adhesive sheet in winding, if the adhesive sheet is not completelybonded to the wafer.

Then, as shown in FIG. 8, such an arrangement is considered that apreliminary peeling unit 200 is provided in course of paying out the rawsheet L in which the release liner PS is temporarily bonded to theadhesive sheet S, and the release liner PS is peeled off preliminarilyfrom the adhesive sheet S before sticking the adhesive sheet S on thewafer W.

With such an arrangement, however, in the case where the adhesive sheetS is a heat sensitive adhesive sheet, there occur the followingdisadvantages. That is, once the adhesive sheet S is peeled off from therelease liner PS, which blocks temporary re-bonding, the adhesive sheetS tends to get wrinkled or sagged. Consequently, when the adhesive sheetS is bonded to the wafer W, bonding operation is carried out in a stateof involving wrinkles and air bubbles therein, which produces massivescale of product defects.

OBJECT OF THE INVENTION

The present invention has been proposed in view of the abovedisadvantages. An object of the present invention is to provide asticking apparatus and a sticking method that can perform a stablepeeling-off to prevent an unnecessary tension force from being appliedto the adhesive sheet, even when adhesive strength between the releaseliner and the adhesive sheet in a raw sheet state of the adhesive sheetis varied.

Another object of the present invention is to provide a stickingapparatus and a sticking method, in which peeling-off strength betweenthe release liner and the adhesive sheet can be equalized and therebysticking of the adhesive sheet on the plate-like member can be performedwith predetermined tension force by means of temporary re-bonding afterthe preliminary peeling-off, and thus a press force by the press roll isimparted to the adhesive sheet through the release liner, enabling tostick the adhesive sheet while precluding the occurrence of wrinkles orthe mixing of air bubbles or the like.

MEANS FOR SOLVING THE PROBLEMS

To achieve the objects, the present invention is arranged so that asticking apparatus includes a sticking table supporting a plate-likemember and a sticking unit that sticks an adhesive sheet to theplate-like member, wherein:

the sticking unit includes a peeling section that, in course of payingout a raw sheet in which the adhesive sheet is temporarily laminated toone side face of a release liner, peels off the release liner and theadhesive sheet; and a preliminary peeling unit that is provided at anupstream side of the peeling section in a pay-out direction of the rawsheet.

Also, the present invention is arranged so that a sticking apparatusincludes a sticking table supporting a plate-like member and a stickingunit that sticks an adhesive sheet to the plate-like member, wherein:

the sticking unit includes a preliminary peeling unit that, in course ofpaying out a raw sheet in which the adhesive sheet is temporarily bondedto one side face of a release liner, peels off the adhesive sheet fromthe release liner, a temporary re-bonding unit that re-bonds temporarilythe preliminarily peeled-off adhesive sheet to the release liner, and apress roll that presses the adhesive sheet to the plate-like member; and

the release liner is pressed by the press roll in a state that thetemporarily re-bonded adhesive sheet is directed to a surface of theplate-like member, thus sticking the adhesive sheet on the plate-likemember.

According to the present invention, the plate-like member may be asemiconductor wafer and the adhesive sheet may be a heat sensitiveadhesive sheet for die bonding.

Further, the plate-like member may be a semiconductor wafer and theadhesive sheet may be a protection sheet that is stuck to form aprotection film.

Furthermore, the preliminary peeling unit may include a moving memberthat is movable in the pay-out direction of the raw sheet, wherein themoving member moves in a state of being pinched between the releaseliner and the adhesive sheet.

The moving member may be composed of a piece which is provided with aplane along the pay-out direction or a roll-shaped member.

Still further, a sticking method according to the present invention inwhich a raw sheet having an adhesive sheet bonded temporarily to oneside face of a release liner is paid out to stick the adhesive sheet ona plate-like member, comprises the steps of:

peeling off the adhesive sheet preliminarily from the release liner incourse of paying out the raw sheet; and then

sticking the adhesive sheet to the plate-like member by pressing thesame to the plate-like member in a state that the adhesive sheet isdirected to the plate-like member.

Still furthermore, a sticking method according to the present inventionin which a raw sheet that an adhesive sheet is temporarily bonded to oneside face of a release liner is paid out to stick the adhesive sheet toa plate-like member, comprises the steps of:

peeling off the adhesive sheet preliminarily from the release liner incourse of paying out the raw sheet;

re-bonding temporarily the adhesive sheet to the release liner that ispeeled-off preliminarily; and then

sticking the adhesive sheet to the plate-like member by pressing thesame to the plate-like member in a state that the temporarily re-bondedadhesive sheet is directed to the plate-like member.

In the sticking method, the adhesive sheet may be a heat sensitiveadhesive sheet.

Also, the adhesive sheet may be a protection sheet that is stuck to forma protection film.

In the sticking method, the plate-like member may be a semiconductorwafer.

Moreover, in the sticking method, the plate-like member may be asemiconductor wafer that is back-ground.

Further, in the sticking method, the temporary re-bonding step may becarried out by imparting heat or static electricity.

In the present document, “temporary bonding” is a state showing initialadhesion properties of such a degree that, when the adhesive sheet isstuck on an object to be stuck (hereinafter simply referred to as“object”) such as wafer or the like and cut in accordance with a shapeor the like of the object, the adhesive sheet is not peeled off orturned up in an area where the same is stuck. “Complete bonding” is astate showing adhesion properties of stronger bonding than temporarybonding with such a degree that the adhesive sheet is not peeled offfrom the object in an operation of the following step. Moreover, whenthe adhesive sheet is a heat-curing type, the complete bonding indicatesa bonding state before curing.

EFFECT OF THE INVENTION

According to the present invention, when the adhesive sheet is paid outfrom the raw sheet, the adhesive sheet can be peeled off preliminarilyfrom the release liner at the upstream side of the peeling section inthe pay-out direction. Thus, even when there is an area locally wheretemporary adhesive strength is excessively strong, a peeling-off delayat the peeling section can be prevented; an adhesive sheet area that isstuck on the plate-like member such as wafer or the like can be freefrom tension force; and warp deformation after the sticking can also beprevented.

In addition, it is arranged so that temporary re-bonding is performedafter the preliminary peeling-off. Therefore, the occurrence of wrinklesor sagging or the like due to the impossibility of temporary re-bondingof the adhesive sheet to the release liner can be effectively prevented;and when the adhesive sheet is bonded to the plate-like member, such adisadvantage that sticking between the adhesive sheet and the plate-likemember is performed in a state of involving wrinkles or air bubblestherein can be eliminated.

BRIEF DESCRIPTION OF DRAWINGS

[FIG. 1]

FIG. 1 is a front view of a sticking apparatus according to a firstembodiment showing schematically an initial state of sticking anadhesive sheet on a wafer.

[FIG. 2]

FIG. 2 is a front view schematically illustrating the operation to cutthe adhesive sheet in a width direction after sticking the adhesivesheet.

[FIG. 3]

FIG. 3 is a perspective view schematically showing a sticking table andan interlock mechanism.

[FIG. 4]

FIG. 4 is a partial sectional view of FIG. 3.

[FIG. 5]

FIG. 5 is a perspective view schematically showing a preliminary peelingunit.

[FIG. 6]

FIG. 6 is a front view of a sticking apparatus according to a secondembodiment showing schematically an initial state of sticking anadhesive sheet on a wafer.

[FIG. 7]

FIG. 7 is a perspective view schematically showing a preliminary peelingunit and a temporary re-bonding unit in the sticking apparatus accordingto the second embodiment.

[FIG. 8]

FIG. 8 is a schematic front view in order to illustrate a problem in thecase where a preliminary peeling-off is carried out to stick an adhesivesheet together with a release liner on a wafer.

EXPLANATION OF CODES

10 sticking apparatus

11 sticking table

12 sticking unit

13 cutting means

33 drive roll (peeling section)

34 pinch roll (peeling section)

45 press roll

40 preliminary peeling unit

41 temporary re-bonding unit

50 moving member

56 piece body (shifting member)

W semiconductor wafer

PS release liner

S adhesive sheet (heat sensitive adhesive sheet)

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention will be describedwith reference to the drawings.

First Embodiment

FIG. 1 is a front view schematically showing a sticking apparatus thatsticks an adhesive sheet on a rear surface side of a wafer. In FIG. 1, asticking apparatus 10 includes a sticking table 11 that receives a waferW as a plate-like member via a conveyance means in a former step andsupports the wafer W and a sticking unit 12 that sticks a heat sensitiveadhesive sheet S for die bonding on the rear surface side (upper faceside) of the wafer W sucked by the sticking table 11. At a side of thesticking unit 12, a cutting means 13 that cuts the adhesive sheet S inthe width direction for every wafer W is disposed. A protection tape PTis stuck preliminarily on a circuit surface side of the wafer W. Thewafer W is supported in a state where the surface thereof on which theprotection tape PT is stuck comes in contact with an upper face of thesticking table 11.

The sticking table 11 is arranged in such a way that the upper face sidethereof is formed as a suction face, and the temperature is maintainedat a predetermined temperature that the adhesive sheet S can be meltedto a settled extent enabling to bond (temporary bonding) to the wafer W.As shown in FIG. 3 and FIG. 4, the sticking table 11 is arranged toinclude a base table 15, an inner table section 16 that is provided atan upper face side of the base table 15 and an outer table section 17that encloses the inner table section 16. The inner table section 16 isprovided in substantially the same plane shape as the wafer W to form asupporting surface of the wafer W and includes a heater H therein sothat the wafer W is maintained at a predetermined temperature. Also, aheat transmission member 20 is disposed in a clearance C formed betweenthe inner table section 16 and the outer table section 17. The heattransmission member 20 is arranged so that the outer table section 17 ismaintained to be a lower temperature than the inner table section 16.Thus, a redundant portion of adhesive sheet SI which protrudes outsidethe wafer W is bonded to the outer table section 17 with weakeradhesion. Accordingly, when the adhesive sheet S is stuck on the waferW, wrinkles or the like are not generated on the wafer W.

Further, as shown in FIG. 1 and FIG. 2, the sticking table 11 issupported by a slide plate 22 movable on a guide rail 21. The stickingtable 11 is arranged to be movable to and from between a positioncapable to receive the wafer W in the former step and a position behindpassing through rightward underneath the sticking unit 12. Furthermore,the sticking table 11 is provided to be movable in the verticaldirection via a lifting unit 25. The lifting unit 25 is arranged toinclude a guide block 27 that is fixed on the slide plate 22, a legmember 28 that is suspended from a bottom face side of the base table 15and is guiding the vertical direction movement along the guide block 27,a lifting force imparting mechanism that is composed of an unshowncylinder or the like, a pair of racks 30, 30, each of which is disposedat an outer surface side of each outer table section 17, and guide bars31, 31, each of which is disposed at an outer surface side of each ofthe racks 30, 30.

As shown in FIG. 1 and FIG. 5, the sticking unit 12 is disposed within aregion of a plate-shaped frame F that is disposed above the stickingtable 11. The sticking unit 12 is arranged to include a support roll 32that supports a raw sheet L, in which the adhesive sheet and a releaseliner PS are temporarily bonded together, and wound in a roll shapeenabling to be supplied; a drive roll 33 and a pinch roll 34 that imparta pay-out force to the raw sheet L; a winding roll 35 that winds therelease liner PS laminated on the adhesive sheet S; two guide rolls 38,38 that are disposed between the support roll 32 and the pinch roll 34;a dancer roll 39 that is provided between the guide rolls 38, 38; apreliminary peeling unit 40 that is provided at an upstream side in apay-out direction of the raw sheet of the adhesive sheet S relative tothe pinch roll 34; a press member 43 that presses a lead end area of theadhesive sheet S, from which the release liner PS has been peeled off,towards the upper face of the sticking table 11 and pinches the lead endarea between the two; a press roll 45 that sequentially presses theadhesive sheet S to the rear surface side (upper face side in FIG. 1) ofthe wafer W for temporary bonding; and a tension roll 46 and a guideroll 47 that are disposed at a position immediately before the pressroll 45 in the pay-out direction of the adhesive sheet S. The press roll45 includes a built-in heater as a heating means. Also, the press member43 includes a suction section at a bottom face side thereof so as tosuck and hold an end portion of the adhesive sheet S.

As shown in FIG. 1 and FIG. 5, the preliminary peeling unit 40 isarranged to include a moving member 50 that is movable along the pay-outdirection of the raw sheet L and a cylinder unit 51 that moves themoving member 50. The moving member 50 is arranged to include a supportshaft 55 that passes through a slit 54 in a front/rear directionprovided in a plane of the frame F and a wing-shaped piece 56 that isfixed to a front edge (above the paper face side edge) of the supportshaft 55 and has a substantially equal length or more than a width ofthe adhesive sheet S from the plane of the frame F to the front. Thepiece 56 is disposed between the adhesive sheet S and the release linerPS. The piece 56 is formed so that smooth circular arc surfaces, each ofwhich comes in contact with each sheet S and PS, are provided at bothleft and right sides thereof and each of upper and lower edges thereofis formed in a pointed head shape to have an extremely small curvatureprofile. Thus, when the piece 56 is moved in the vertical direction bythe driving of the cylinder unit 51, the piece 56 forcibly and smoothlyseparates the adhesive sheet S and the release liner PS that arelaminated to perform a preliminary peeling-off in a stage before apeeling-off at a peeling section. The moving member 50 does not preventto use a roll-shaped member or the like instead of the piece 56.

The drive roll 33, the pinch roll 34 and the winding roll 35 compose apeeling section to peel off the adhesive sheet S and the release linerPS that are in a state of raw sheet. Among the rolls, the rolls 33 and35 are arranged to be rotationally driven by motors M1 and M2respectively that are provided at a rear surface side of the frame F.Further, the press member 43, the press roll 45 and the tension roll 46are provided to be movable in the vertical direction through cylinders60, 61 and 62 respectively. As shown in FIG. 3 and FIG. 4, both edgesides of the press roll 45 are connected to the cylinder 61 throughbrackets 64. A pair of pinions 67, 67 that interact with the racks 30 tocompose an interlock mechanism are disposed at both edge sides of arotating center shaft 66. A pair of rollers 68, 68 as a rotator aredisposed at further outer positions of the pinions 67. The pinions 67,67 are provided enabling to be engaged with the racks 30, 30. Meanwhile,the rollers 68, 68 are arranged to rotate on the guide bars 31regardless of a rotation of the press roll 45.

As shown in FIG. 1 and FIG. 2, the cutting means 13 includes an arm 70extending along a moving direction of the sticking table 11 and a cutterunit 72 provided to be movable forward/backward through a uniaxial robot71, which is disposed on a bottom face in a front-end side (left endside in FIG. 1) of the arm 70. The cutter unit 72 is arranged to includea cutter lifting cylinder 75 that is supported by the bracket 74 movingalong the uniaxial robot 71 and a cutter 77 that is attached to a frontend of the cutter lifting cylinder 75. Here, the cutter lifting cylinder75 is attached to the bracket 74 in a state of being rotatable in asubstantially vertical plane. Thus, a cutting edge angle of the cutter77 can be adjusted in a state that a front end position of the cutter 77moves along a circular arc in the substantially vertical plane.Furthermore, the cutter lifting cylinder 75 is arranged to be movableforward/backward by the uniaxial robot 71 along the extending directionof the arm 70. As shown in FIG. 1, the cutting means 13 is supported tobe movable on a guide 79 by the driving of a motor M3. The guide 79 isdirected to an orthogonal direction (orthogonal direction to the page inFIG. 1) relative to the moving direction of the sticking table 11.Accordingly, when a front edge of the cutter 77 is set to be insertedinto a cutter receiving groove 11A of the sticking table 11 and theentire cutting means 13 moves along the guide 79, the adhesive sheet Scan be cut in the width direction.

Then, a sticking method of the adhesive sheet S according to a firstembodiment will be described.

The wafer W is transferred to the sticking table 11 in a state that aface, on which the protection tape PT is stuck, is positioned at abottom face side and is sucked to be supported by the sticking table 11with the rear surface of the wafer W as an upper face side.

As shown in FIG. 1, when the sticking table 11 is moved to apredetermined position of the sticking unit 12, the lead end area of theadhesive sheet S that is sucked and held at the bottom face side of thepress member 43 comes into contact with the upper face of the stickingtable 11 by a downward movement of the press member 43. The stickingunit 12 is set so that in an initial operation of laying around the rawsheet L, the piece 56 is sandwiched between the adhesive sheet S and therelease liner PS, in a state of being separated from each other. Then,before the lead end of the adhesive sheet S is pressed to the outertable section 17 by the press member 43, the piece 56 once reciprocatesfrom a position shown in FIG. 1 to the upper side so as to form apreliminary peeled off area and then stopped. After that, while thepiece 56 is stopped, the press roll 45 moves downward to pinch theadhesive sheet S between the upper face of the wafer W and the same, andthe redundant portion of adhesive sheet S1 other than the wafer W areacomes in contact with the outer table section 17. Then, the press member43 releases the suction and moves up. At this time, the rollers 68provided at both end sides of the press roll 45 comes in contact with anupper face of the guide bars 31, and simultaneously, the pinions 67engage with the racks 30 to become rotationally movable along the racks30. In this state, the sticking table 11 is moved rightward in FIG. 1.Owing to the engagement between the racks 30 and the pinions 67, thepress roll 45 rotates and the rollers 68 roll to move on the guide bars31 as a guide surface. Thus, the adhesive sheet S paid out sequentiallyis stuck to the upper face of the wafer W. In sticking operation, theredundant portion of adhesive sheet S1 that is protruded from aperiphery of the wafer W is bonded to the outer table section 17 withweak adhesion. Therefore, when the press roll 45 is moving on the waferW while rotating, such a disadvantage does not occur that the wafer W ispulled by tension force of the adhesive sheet S and press force of thepress roll 45, resulting in that wrinkles are formed. Note that thepress roll 45 is controlled at a predetermined temperature by thebuilt-in heater as the heating means.

As described above, when the adhesive sheet S is stuck to the wafer Wand the press member 43 reaches an upper position immediately afterpassing through the cutter receiving groove 11A, the press member 43moves downward to make the adhesive sheet S in contact with the stickingtable 11 (refer to FIG. 2). After that, the cutter 77 of the cuttingmeans 13 is inserted into the cutter receiving groove 11A, and the arm70 supporting the cutter unit 72 moves to the orthogonal direction ofthe paper sheet in FIG. 2 so as to cut the adhesive sheet S in the widthdirection. After the completion of the cutting in the width direction,the press member 43 sucks the adhesive sheet S positioned at the bottomface side of the press member 43 and returns to the upper position,waiting for bonding operation of successive wafer W. Also, owing to therising of the cutter lifting cylinder 75, the cutting edge of the cutter77 is displaced toward a upper position, and the cutting means 13retreats in a direction of separating from the upper face position ofthe sticking table 11, that is, to the upper side in FIG. 1.

The wafer that the adhesive sheet S is stuck thereon is transferred viaa transfer unit or the like to a periphery cutting device, and theadhesive sheet S is cut along a periphery edge of the wafer W to removethe outer redundant portion of the adhesive sheet.

According to the sticking apparatus 10 of the first embodiment asdescribed above, even when an area of strong temporary adhesion existspartially in a state of raw sheet in which the adhesive sheet S islaminated on the release liner PS, a specific amount along the pay-outdirection is peeled off preliminarily by the preliminary peeling unit40. Accordingly, the adhesive sheet S and the release liner PS afterpassing through the preliminary peeling unit 40 can be smoothly peeledoff at the peeling section immediately after that, which prevents apeeling-off delay. Owing to the prevention of such a peeling-off delay,unnecessary tension force imparting to the adhesive sheet S between thepeeling section and the press roll 45 can be prevented, and warpdeformation is not generated to the wafer W on which the adhesive sheetS is stuck.

Second Embodiment

Next, a second embodiment of the present invention will be describedwith reference to FIG. 6 and FIG. 7. The second embodiment is arrangedso that, after the preliminary peeling-off, the adhesive sheet S istemporarily re-bonded to the release liner PS without winding therelease liner PS so as to stick the adhesive sheet S on the wafer W.

That is, a temporary re-bonding unit 41 that repeats to bond temporarilythe release liner PS to the adhesive sheet S that is preliminarilypeeled-off is provided at a downstream side from the drive roll 33. Thetemporary re-bonding unit 41 is arranged to include a pair of built-inheater type rolls 41A, 41B that are disposed so as to pinch the rawsheet L, or the adhesive sheet S and the release liner PS.

When the adhesive sheet S and the release liner PS that has beenpreliminary peeled off pass through the rolls 41A, 41B, the adhesivesheet S and the release liner PS are temporarily re-bonded so thattemporary adhesive strength becomes constant along the extendingdirection by the heat of the rolls 41A, 41B. It is arranged so that thetemporary adhesive strength can be set variably according to thematerial and thickness of the adhesive sheet S or the release liner PS,and mechanical properties of the sticking apparatus 10 or the like.

The sticking of the adhesive sheet S according to the second embodimentis performed substantially in the same way as the first embodiment,except the arrangement in which the release liner PS and the adhesivesheet S are temporarily re-bonded, and thus, the press roll 45 comes incontact with the release liner PS to press the release liner PS.

Similar to the first embodiment, the wafer W that the adhesive sheet Sof the raw sheet L is stuck thereon as described above is transferred tothe periphery cutting device via the transfer unit or the like, and theadhesive sheet S is cut along a periphery edge of the wafer W to removethe outer redundant portion of the adhesive sheet.

The other arrangement and operation are the same as those of the firstembodiment.

Therefore, according to the second embodiment as described above, it isarranged so that the temporary re-bonding is carried out after the rawsheet L composing of the adhesive sheet S and the release liner PS ispreliminarily peeled off, consequently such a disadvantage can beprevented as occurrence of wrinkles or sagging on the adhesive sheet, asshown in FIG. 8, which are caused by the fact that the adhesive sheet Scan not be temporarily re-bonded and thereby losing a proper tensionforce of the adhesive sheet. Accordingly, the adhesive sheet S can bebonded to the wafer W in a state of preventing the wrinkles or themixing of air bubbles. In addition, the press-roll 45 is arranged toimpart a press force to the adhesive sheet S via the release liner PS,and thus, the adhesive does not adhere to the press roll 45.

As described above, the best arrangement and method for carrying out thepresent invention have been disclosed in the forgoing description.However, the present invention is not limited to the above.

That is, although the present invention has been mainly illustrated anddescribed about specified embodiments, it is possible for ones skilledin the art, if necessary, to add various modifications to shape,position, disposition or the like with respect to the above-describedembodiments without departing from the scope of the technical idea andobject of the present invention.

For instance, the sticking apparatus 10 according to the embodiments hasbeen illustrated and described as an apparatus that sticks the heatsensitive adhesive sheet S for die bonding on the wafer W, but anothersheet may be applied. For instance, a dry resist film or a sheet forforming a protection film or the like may be applicable when stuck onthe wafer W.

Further, such a case has been illustrated and described that the objectto which the adhesive sheet S is stuck is the wafer W, but the presentinvention is not limited to it. The object may be other plate-likemembers.

Furthermore, such a case has been illustrated and described that a pairof rolls 41A, 41B of built-in heater type are adopted as the temporaryre-bonding unit 41, but the present invention is not limited to it. Thatis, the rolls may not be a built-in heater type. In this case, such achamber may be provided that is maintained at a predetermined heattemperature and the rolls may be disposed in the chamber. Still further,the adhesive sheet S and the release liner PS may be charged with staticelectricity to bond preliminarily to each other. In short, in thetemporary re-bonding according to the present invention, if thetemporary adhesive strength can be evenly readjusted along the extendingdirection of the raw sheet L, any arrangement is acceptable.

1. A sticking apparatus comprising: a sticking table supporting aplate-like member; and a sticking unit that sticks an adhesive sheet tosaid plate-like member, wherein: said sticking unit includes a peelingsection that, in course of paying out a raw sheet in which the adhesivesheet is temporarily laminated to one side face of a release liner,peels off the release liner and the adhesive sheet; and a preliminarypeeling unit that is provided at an upstream side of the peeling sectionin a pay-out direction of the raw sheet.
 2. A sticking apparatuscomprising: a sticking table supporting a plate-like member; and asticking unit that sticks an adhesive sheet to said plate-like member,wherein: said sticking unit includes a preliminary peeling unit that, incourse of paying out a raw sheet in which the adhesive sheet istemporarily bonded to one side face of a release liner, peels off theadhesive sheet from said release liner, a temporary re-bonding unit thatre-bonds temporarily the adhesive sheet preliminarily peeled-off to saidrelease liner, and a press roll that presses the adhesive sheet to saidplate-like member; and said release liner is pressed by the press rollin a state that said temporarily re-bonded adhesive sheet is directed toa surface of said plate-like member, thus sticking said adhesive sheeton the plate-like member.
 3. The sticking apparatus according to claim 1or 2, wherein: said plate-like member is a semiconductor wafer and saidadhesive sheet is a heat sensitive adhesive sheet for die bonding. 4.The sticking apparatus according to claim 1 or 2, wherein: saidplate-like member is a semiconductor wafer and said adhesive sheet is aprotection sheet that is stuck to form a protection film.
 5. Thesticking apparatus according to claim 1 or 2, wherein: said preliminarypeeling unit includes a moving member that is movable in the pay-outdirection of the raw sheet; and the moving member moves in a state ofbeing pinched between the release liner and the adhesive sheet.
 6. Thesticking apparatus according to claim 5, wherein: said moving member iscomposed of a piece which is provided with a plane along said pay-outdirection or a roll-shaped member.
 7. A sticking method in which a rawsheet having an adhesive sheet bonded temporarily to one side face of arelease liner is paid out to stick said adhesive sheet on a plate-likemember, comprising the steps of: peeling off the adhesive sheetpreliminarily from said release liner in course of paying out said rawsheet; and then sticking said adhesive sheet to plate-like member bypressing the adhesive sheet to the plate-like member in a state thatsaid adhesive sheet is directed to said plate-like member.
 8. A stickingmethod in which a raw sheet having an adhesive sheet bonded temporarilyto one side face of a release liner is paid out to stick said adhesivesheet to a plate-like member, comprising the steps of: peeling off theadhesive sheet preliminarily from said release liner in course of payingout said raw sheet; re-bonding temporarily said adhesive sheetpeeled-off preliminarily to said release liner; and then sticking saidadhesive sheet to the plate-like member by pressing said release linerin a state that said re-bonded adhesive sheet temporarily is directed tosaid plate-like member.
 9. The sticking method according to claim 7 or8, wherein: said adhesive sheet is a heat sensitive adhesive sheet. 10.The sticking method according to claim 7 or 8, wherein: said adhesivesheet is a protection sheet that is stuck to form a protection film. 11.The sticking method according to claim 7 or 8, wherein: said plate-likemember is a semiconductor wafer.
 12. The sticking method according toclaim 7 or 8, wherein: said plate-like member is a semiconductor waferthat is background.
 13. The sticking method according to claim 8,wherein: said temporarily re-bonding step is carried out by impartingheat or static electricity.